Samsung confirms ‘cutting edge’ Galaxy phone upgrade coming next month

If you love all things Samsung then it’s worth popping Wednesday, July 10 in your diary. The Korean technology giant has just confirmed that is when it will unleash its next batch of Galaxy phones which will feature “cutting-edge innovations”. If history repeats itself it’s almost certain that Samsung will use next month’s Unpacked event to showcase its latest foldable devices.

The Galaxy Z Flip and Z Fold range hasn’t been upgraded since last August and Samsung almost always reveals major updates to its bendy devices in July.

“On July 10, Samsung Electronics will host Galaxy Unpacked in Paris — where the iconic cultural nexus and trend epicenter becomes the perfect backdrop for the rollout of our latest cutting-edge innovations,” Samsung said in a post on its website.

Samsung won’t reveal full specs until the launch but we can expect all the usual changes such as better screens, new design, improved cameras and more power under the hood. Unlike the Galaxy S phones which use a mix of processors, the new Z devices look set to all get the latest and greatest Snapdragon 8 Gen 3 chip from Qualcomm making things a little less confusing for consumers.

We also know for sure that all the upcoming Galaxy smartphones will get smarter thanks to built-in AI. The S24 first included this smart update when it launched back in January – now the Z range appears to be following in its tracks.

“The next frontier of Galaxy AI is coming,” Samsung confirmed.

“Prepare to discover the power of Galaxy AI, now infused into the latest Galaxy Z series and the entire Galaxy ecosystem. Get ready for a world of possibilities as we enter a new phase of mobile AI.”

The intelligent changes should allow Z Flip and Fold users to take better photos, translate calls in real-time and transcribe recordings into fully editable text.

Express.co.uk will bring you all the news live from this launch and Samsung’s timing couldn’t be better.

Leave a Reply

Your email address will not be published. Required fields are marked *